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data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 1 general description the AP3211 is a 1.4mhz fixed frequency, current mode, pwm buck (step-down) dc-dc converter, capable of driving a 1.5a lo ad with high efficiency, excellent line and load regulation. the device integrates n-channel power mosfet switch with low on-resistance. current mode control provides fast transient response and cycl e-by-cycle current limit. a standard series of indu ctors are available from several different manufacturers optimized for use with the AP3211. this feature greatly simplifies the design of switch-mode power supplies. the AP3211 is available in sot-23-6 package. features ? input voltage range: 4.5v to 18v ? output voltage adjustable from 0.81v to 15v ? fixed 1.4mhz frequency ? high efficiency: up to 92% ? output current: 1.5a ? current mode control ? built-in over current protection ? built-in thermal shutdown function ? built-in uvlo function ? built-in over voltage protection ? built-in soft-start applications ? lcd tv ? dpf ? portable dvd figure 1. package type of AP3211 sot-23-6
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 2 bs 1 2 34 5 pin 1 dot by marking 6 gnd fb sw in en pin configuration k package (sot-23-6) figure 2. pin configuration of AP3211 (top view) pin description pin number pin name function 1 bs bootstrap pin. a bootstrap capacitor is connected between the bs pin and sw pin. the voltage across the bootstrap capacitor drives the internal high-side nmos switch 2 gnd ground pin 3 fb feedback pin. this pin is conn ected to an external resistor divider to program the system output voltage. when v fb exceeds 20% of the nominal regulation value of 0.81v, the ovp is triggered. when v fb 0.25v, the oscillator frequency is lowered to realize short circuit protection 4 en control input pin. forcing this pin above 1.5v enables the ic. forcing this pin below 0.4v shuts down the ic. when the ic is in shutdown mode, all functions are disabled to decrease the supply current below 1 a 5 in supply input pin. a capacitor should be connected between the in pin and gnd to keep the dc input voltage constant 6 sw power switch output pin. this pin is connected to the inductor and bootstrap capacitor
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 3 functional block diagram figure 3. functional block diagram of AP3211 ordering information AP3211 - circuit type g1: green package tr: tape & reel k: sot-23-6 package temperature range part number marking id packing type sot-23-6 -40 to 85 c AP3211ktr-g1 gci tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green.
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 4 absolute maximum ratings (note 1) parameter symbol value unit input pin voltage v in -0.3 to 20 v en pin voltage v en -0.3 to v in +0.3 v sw pin voltage v sw 21 v bootstrap pin voltage v bs -0.3 to v sw +6 v feedback pin voltage v fb -0.3 to 6v v thermal resistance ja 220 oc/w operating junction temperature t j 150 oc storage temperature t stg -65 to 150 oc lead temperature (soldering, 10sec) t lead 260 oc note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. recommended operating conditions parameter symbol min max unit input voltage v in 4.5 18 v maximum output current i out (max) 1.5 a operating ambient temperature t a -40 85 oc
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 5 electrical characteristics v in =v en =12v, v out =3.3v, t a =25 oc , unless otherwise specified. parameter symbol conditions min typ max unit input voltage v in 4.5 18 v quiescent current i q v fb =0.9v 0.8 1.1 ma shutdown supply current i shdn v en =0v 0.1 1.0 a feedback voltage v fb 0.785 0.810 0.835 v feedback over voltage threshold v fbov 0.972 v feedback bias current i fb v fb =0.85v -0.1 0.1 a switch on-resistance r dson i sw =1a 0.35 switch leakage current i leak v in =18v, v en =0v 0.1 10 a switch current limit i lim 1.8 2.4 a v enh 1.5 en pin threshold v enl 0.4 v input uvlo threshold v uvlo v in rising 3.3 3.8 4.3 v input uvlo hysteresis v hys 0.2 v f osc1 1.1 1.4 1.7 mhz oscillator frequency f osc2 short circuit 460 khz max. duty cycle d max v fb =0.6v 90 % min. duty cycle d min v fb =0.9v 0 % minimum on time t on 100 ns thermal shutdown t otsd 160 oc thermal shutdown hysteresis t hys 20 oc soft-start time t ss 200 s note 2: r dson , t on, t otsd, t hys and t ss are guaranteed by design.
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 6 typical performance characteristics t a =25oc, v in =12v, v en =5v v out =3.3v, unless otherwise noted. figure 4. efficiency vs. output current figure 5. quiescent current vs. temperature figure 6. feedback voltage vs.temperature figure 7. output voltage vs. output current 0.01 0.1 0.5 1 2 0 10 20 30 40 50 60 70 80 90 100 efficiency (%) output current (a) v in =12v,v out =3.3v v in =12v,v out =5v -60 -40 -20 0 20 40 60 80 100 120 140 160 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 1.10 quiescent current (ma) temperature ( o c) v in =12v v fb =0.9v v en =5v -60 -40 -20 0 20 40 60 80 100 120 140 160 0.40 0.48 0.56 0.64 0.72 0.80 0.88 0.96 feedback voltage (v) temperature ( o c) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 v in =12v, v out =3.3v output voltage (v) output current (a)
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 7 typical performance characteristics (continued) t a =25oc, v in =12v, v en =5v v out =3.3v, unless otherwise noted. figure 8. output voltage vs. input volta ge figure 9. maxi mum output current vs. input voltage figure 10. output ripple (i out =1.5a) figure 11.load transient (i out =1 to 1.5a) 4 6 8 101214161820 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 output voltage (v) input voltage (v) i out =1.2a i out =1.5a 4 6 8 101214161820 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 maximum output current (a) input voltage (v) v out =3.3v v out (ac) 20mv/div v sw 5v/div i l 1a/div v in 10v/div v out (ac) 100mv/div i l 1a/div time (400ns/div) time (100 s/div)
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 8 typical performance characteristics (continued) t a =25oc, v in =12v, v en =5v v out =3.3v, unless otherwise noted. figure 12. enable turn-on characteristic figure 13. enable turn-off characteristic (resistance load, r load =2.6 ) (resistance load, r load =2.6 ) figure 14. short circuit protection (i out =1.5a) figure 15.short circuit recovery (r load =2.6 ) time (100 s/div) v en 3.8v/div v out 1v/div v sw 5v/div i l 1a/div v en 3.4v/div v out 1v/div v sw 5v/div i l 1a/div time (10 s/div) v fb 1v/div v out 2v/div i l 1a/div v sw 10v/div time (400 s/div) time (400 s/div) v out 2v/div v fb 1v/div i l 1a/div v sw 10v/div
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 9 typical performance characteristics (continued) t a =25oc, v in =12v, v en =5v v out =3.3v, unless otherwise noted. figure 16. over voltage protection (i out =1.5a) figure 17. over voltage recovery (i out =1.5a) time (20 s/div) v fb 500mv/div v out 2v/div i l 1a/div v sw 10v/div v fb 500mv/div v out 2v/div i l 1a/div v sw 10v/div time (200 s/div)
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 10 typical application figure 18. typical application circuit of AP3211
data sheet 1.4mhz, 1.5a asynchro nous dc-dc buck conv erter AP3211 jul. 2011 rev. 1.3 bcd semiconductor manufacturing limited 11 mechanical dimensions sot-23-6 unit: mm(inch) 2.820(0.111) 3.020(0.119) 0.950(0.037)typ 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)ref 0.100(0.004) 0.200(0.008) 0 8 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) max 123 4 5 6 pin 1 dot by marking
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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